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Tungsten – Titanium Sputtering Target

W – Ti, 90/10 wt%, 80/20 wt%

 

Bayville Chemical Supply produces very high purity Tungsten - Titanium Sputtering Targets with the highest possible density and smallest possible average grain sizes.

 

Application: W-Ti with 10 % Ti by weight is used as a diffusion barrier and adhesion layer during the metallization process in microchips fabrication. Widely used in coating processing industries such as optical data storage application and film coating.

 

                       Purity:                                 99.95 – 99.999% pure

                       Molecular Weight:            231.71

                       Bulk Density:                      > 98%

                       Grain Size:                          < 20 μm typically

                       Bonding:                            Indium and Elastomer

 

Diameter:                        ~25 mm to ~400 mm, (1” – 16 inch) diameters

Length / Width:              25.4 mm to ~400 mm, (1 inch up to 16 inch)

Thickness:                        1 mm, 3 mm, 6 mm, 12.7 mm 

Custom size and shapes available upon request.

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