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Tungsten Foil
99 - ≥ 99.95% pure
Tungsten foil is produced by cold rolling the tungsten sheet to a lower thickness. The stamped and drawn foil is very suitable to use in the applications of high temperature vacuum furnace, coating, electronics and semiconductor components. Tungsten foil is used to make heat shielding, heating element and carrier of the vacuum furnace. It is because tungsten foils process a high heat resistance in the high temperature environment.
In addition, tungsten foil owns an extremely Low Vapor Pressure and a high melting point so that it is ideally served for coating application as the evaporation boat. Moreover, the ideal material for semiconductor needs to have a Low Coefficient of Thermal Expansion and Low Electrical Resistivity. Tungsten can meet these requirements. Therefore, it is a very suitable material for components of the semiconductor industry. Tungsten has been also approved to be a promising material to explore in further in medical and Sputtering applications.
CAS# 7440-37-7
Atomic Number 74
Atomic Weight 183.85
Density 19.3 gm/cm3
Melting Point 3410oC
Boiling Point 5900oC
Electrical Resistivity 5.65 microhm-cm @ 27oC
Thermal Conductivity 1.73 W/cm/K @ 298.2 K
Electronegativity: 1.7 Paulings
Specific Heat: 0.0317 Cal/g/K @ 25oC
Heat of Vaporization: 185 K-Cal/gm atom at 5660oC
Heat of Fusion: 8.42 Cal/gm mole
Available thicknesses: 0.01 mm to 2.0 mm
Foil dimensions: 25 mm x 25 mm, 50 mm x 50 mm, 100 mm x 100 mm
Strip lengths to: 24 inch (609 mm) long
We also offer Tungsten Heavy Alloy and Tungsten Copper along with other Alloys.