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99.6% - 99.999% Pure
Applications:
Titanium Sputter Targets are characterized by their strength, corrosion resistance and lightness. They are widely used in the aerospace industry. Their special properties also make them suitable for medical applications such as replacement hip joints.
Decorative Coatings Hardware/Tool Coatings
Semiconductor Flat Panel Display
Specifications:
Symbol Ti
CAS# 7440-32-6
ECN# 231-142-3
Molecular Weight 47.87 gm/mol
Boiling Point 3287oC
Melting Point 1660oC
Density 4.5 gm/cm3 (at 25oC)
Appearance Silvery Metallic
Thermal Conductivity 21.9 W/m.K
Coefficient of Thermal Expansion 8.6 x 10-6/K
Sputter DC
Maximum Power Density 50 Watts/inch2*
Bonding Type Indium, Elastomer
*This is only our recommendation, based on unbonded targets. Bonded targets should be run at lower powers to prevent bonding failures. Bonded targets should be run at 20 Watts/in2 or lower, depending on the material.
Typical Analysis:
Aluminum 0.0005% Nitrogen 0.0002%
Boron 0.0003 Oxygen 0.003
Carbon 0.0008 Palladium 0.00008
Chromium 0.0005 Phosphorus 0.00008
Cobalt 0.0002 Silver 0.00002
Copper 0.0001 Tin 0.0001
Iron 0.0008 Tungsten 0.0005
Lead 0.00001 Vanadium 0.00008
Manganese 0.0002 Zinc 0.0002
Molybdenum 0.00021
Each sputtering target is supplied with the actual chemical analysis.